Nano-Particle and Bubble Control Technologies（nPC）
(Joint Development Program with AIST)
Nano particles and bubbles in liquid materials are one of the biggest problems in semiconductor manufacturing processes. Conventional measurement tool, “LPC” (Liquid Particle Counter), cannot respectively detect them in liquid. This program will develop new measurement tools and standard test methods to make such 10nm sized particles and bubbles separately detectable in liquid.
Nano-Control Technologies for DSA Nano-Patterning
Nano-Control Technologies for DSA (Directed Self-Assembly) of block copolymers are studied for realizing single nano-scaling silicon semiconductor device manufacturing with low cost. Especially, the program develops the nano-control technologies of line edge roughness, placement errors and defects in guide patterns and DSA phase separation patterns with high speed and high accuracy.
Resist Technologies for nano-Patterning
Leading edge nano-measurement technologies are currently being evaluated and verified for application in the analysis of resist materials (i.e. metal-based resists) in lithography. Investigations on the characterization and clarification of resist-related reaction mechanisms are also performed based on the analyzed results. Moreover, correlation studies between actual resist patterning results and obtained resist characteristics are carried out. These efforts seek to promote and, in effect, shorten the period for the research and development of metal-based resist materials.
Resist Outgassing Control Technologies for nano-patterning
The Outgassing of the next-generation EUV resist, generating by the novel reaction mechanism during exposure, is one of the big issues concerning the realization of EUV lithography beyond 10 nm node. This program will establish the outgassing test method for the next-generation resist to contribute to the resist development and quality control technology for EUV exposure tools.
Nano-Defect Inspection Technologies（nDI）
EIDEC will develop a defect inspection standard technology by fabricating and measuring standard samples with programmed defects in order to calibrate defect detection sensitivity of a future defect inspection.